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ob die ¿ID¿ - Bewegung die Wissenschaft voranbringen
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Elektrostatik -- Zweites Kapitel
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages formatIsbn:Softcover - 9781461372769 ob die ¿ID¿ - BewegungOne of the greatest challenges facing package manufacturers is to develop reliable fine pitch thin packages with high leadcounts, capable of dissipating heat, and deliver them in volume to the market in a very short space of time. How can this be done? Firstly, package structures, materials, and manufacturing processes must be optimised. Secondly, it is necessary to predict the likely failures and behaviour of parts before manufacture, whilst
